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Magazine Name : Ieee Transactions On Components, Packaging, And Manufacturing Technology Part-B: Advanced Packaging

Year : 1995 Volume number : 18 Issue: 04

A Silicon-On-Silicon Field Programmable Multichip Module (Fpmcm) Integrating Fpga And Mcm Technologies (Article)
Subject: Field Progammable Gate Arary (Fpga) , Field Programming , Mcm , Fpga
Author: Joel Darnauer      T Isshiki      B. K. Maheshwari     
page:      601 - 608
Experimental Characterization Of Simultaneous Switching Noise For Multichip Modules (Article)
Subject: Multichip Module , Mcm , Simultaneous Update
Author: K Ito      K Kato      Naohiko Hirano     
page:      609 - 613
Modeling And Analysis Of Multichip Module Power Supply Planes (Article)
Subject: Modeling , Multichip Module , Supply
Author: Keunmyung Lee      Alan Barber     
page:      628 - 639
A Clustered Yield Model For Smt Boards And Mcm'S (Article)
Subject: Yields From Compost-Amended Plots , Mcm , Clustered , Board
Author: Mick M. V Tegethoff      T Chen     
page:      640 - 643
Laddering Wave In Serpentine Delay Line (Article)
Subject: Delay Line , Signal Integrity , Crosstalk
Author: Ruey-Beei Wu      Fang-Lin Chao     
page:      644 - 650
Application Of Ring Oscillators To Characterize Transmission Lines In Vlsi Circuits (Article)
Subject: Ring Oscillator , Transmission , Laser Linking
Author: Lohit S. Dutta      Thomas Hillmann-Ruge     
page:      651 - 657
Evaluation Of Polymeric Coatings For Mcm Applications (Article)
Subject: Nonhermetic Coating , Accelerated Aging , Corrosion , Moisture
Author: Ramesh Kodnani      Donald Jaffe      Ralph Jaccodine     
page:      658 - 665
Automated X-Ray Inspection Of Chip-To-Chip Interconnections Of Si-On-Si Mcm'S (Article)
Subject: Si-On-Si Mcm , X-Ray Imaging , Image Processing
Author: Zhang Tong      T. Warren Liao      Caleb A. Strittmatter     
page:      666 - 674
Computer Vision For Automatic Inspection Of Complex Metal Patterns On Multichip Modules (Mcm-D) (Article)
Subject: Image Analysis , Image Processing , Pattern Recognition
Author: Michael E. Scaman      Laertis Economikos     
page:      675 - 684
Efficient Multimode Optical Fiber-To-Waveguide Coupling For Passive Alignment Applications In Multichip Modules (Article)
Subject: Coupling , Efficient , Coupling
Author: Timothy S. Barry      Daniel L. Rode      K. Nakagawa     
page:      685 - 690
A Novel Type Of Low Dielectric And Heat-Resistant Resin For Printed Wiring Boards (Article)
Subject: Advanced Ceramics , Glass Transition Temperature , Dielectric
Author: Kazunari Nawa      Masakazu Ohkita     
page:      691 - 696
Diode Laser-Assisted Pyrolysis Of Organometallic Films For The Fabrication Of Metallic Conductors On Polyimide (Article)
Subject: Diodes , Packaging , Copper , Interconnects
Author: Stephane Evoy      E Izquierdo      Edward Sacher     
page:      697 - 703
Reinforcing Effect Of Coverlayers On The Fatigue Life Of Copper-Kapton Flex Cables (Article)
Subject:
Author:
page:      709 - 714
Corrosion And Adhesion Of Multilayer Pad Structures For Packaging Applications (Article)
Subject: Corrosion , Adhesion , Chromium
Author: Gerald S. Frankel      Sampath Purushothaman      Vlasta Brusic     
page:      709 - 714
Application Of Direct Strain Measurement To Fatigue Studies In Surface Solder Joints (Article)
Subject: Strain Measurement , Fatigue , Surface Area
Author: Yan C. Chan      J. K. L. Lai      I. K. Hui     
page:      715 - 719
Modeling And Experimental Studies On Thermosonic Flip-Chip Bonding (Article)
Subject: Modeling An Airlift , Studies At Enclosed Longmont , Flip Chip
Author: Sa-Yoon Kang      Paul M. Willams      Yung-Chang Lee     
page:      728 - 733
Application Of The Taguchi Method On The Robust Design Of Molded 225 Plastic Ball Grid Array Packages (Article)
Subject: Application , Ball Grid Array , Molded Parts
Author: Atila Mertol     
page:      734 - 743
Effects Of Fillers On Wire Sweep In Semiconductor Chip Encapsulation (Article)
Subject: Encapsulation , Semiconducters , Wire Rope , Transfer Mode
Author: Sejin Han      K. K. Wang     
page:      744 - 750
Low-Temperature, Low-Dielectric, Crystallizable Glass Composite (Article)
Subject: Low Temperature , Low Dielectric Constant , Glass Fiber
Author: Jau-Ho Jean      Shih-Chang Lin      Chia-Ruey Chang     
page:      751 - 754